SinoTechIntel Academic Portal
Open AccessDOI: 10.1186/s10033-025-01350-3Original Research

Simulation Analysis of How Scratches Influence Frequency Splitting and Energy Dissipation of Hemispherical Resonator

Jingyang Guo¹,Henan Liu¹,Mingjun Chen¹,Jian Cheng¹

State Key Laboratory of Robotics and System, Harbin Institute of Technology, Harbin 150001, China

Read Executive PreviewQuick FAQ
Simulation Analysis of How Scratches Influence Frequency Splitting and Energy Dissipation of Hemispherical Resonator
Graphical Abstract / Figure
Published In
Chinese Journal of Mechanical Engineering
Published:January 15, 2025Edition:Vol. 38, Issue 1 • pp. 189Citation:Jingyang Guo et al. (2025), Chinese Journal of Mechanical Engineering
Impact FactorPeer-Reviewed Core
Sponsored Research Partner

Key Takeaways & Executive Findings

  • • Scratches above 55° latitude induce frequency splitting solely via stiffness changes, while lower-latitude scratches affect mass and damping. • Frequency splitting from scratches at the rim is about 50% of that near the transition fillet for the same scratch size, highlighting location-dependent sensitivity. • Frequency splitting increases linearly with the volume of material removed by scratches, enabling predictive modeling for trimming. • Scratches have negligible effect on thermoelastic damping, but the first three harmonics of unbalanced mass at the rim dominate anchor loss, guiding defect mitigation strategies.
Sponsored Research Highlight

Abstract

The fused quartz hemispherical resonator is the core component of the hemispherical resonator gyroscope. It features a complex shape and is made from a material that is difficult to process. Scratches are easily introduced during grinding, potentially degrading the mass-stiffness-damping symmetry; however, the underlying mechanisms of this influence have not been fully understood. This paper aims to investigate the effects of scratch defects on the frequency splitting and quality factor of the hemispherical resonator. First, finite element models of the hemispherical resonator with scratches are established. Then, the effects of the mass-stiffness factor, as well as the latitude and length of the scratches, on frequency splitting are analyzed. Furthermore, the impacts of latitude, length, and the first four harmonics of the unbalanced mass caused by scratches on thermoelastic damping and anchor loss are examined. Simulation results indicate that scratches above 55° latitude cause frequency splitting solely due to stiffness changes. Frequency splitting caused by scratches of the same size on the inherent rigidity shaft at the rim is approximately 50% of that near the transition fillet. Frequency splitting varies linearly with the volume of material removed by scratches. Scratches have little effect on thermoelastic damping. The first three harmonics of the unbalanced mass due to scratches at the rim are the primary contributors to anchor loss. Finally, focused ion beam trimming experiments are conducted at different locations on the hemispherical resonator. The trends observed in the experimental results are consistent with the simulation results. This work provides guidance for evaluating the impact of scratches on the performance of hemispherical resonators and for developing appropriate trimming processes.

1. Introduction

The hemispherical resonator gyroscope (HRG) is considered a disruptive technology in the field of high-precision navigation. It offers advantages such as high precision, long lifespan, high reliability, and strong resistance to impact and electromagnetic interference [1–3]. The fused quartz hemispherical resonator is the core component of the HRG. It is a hard, brittle, thin-walled hemispherical structure. A high-performance hemispherical resonator should exhibit minimal frequency splitting and a high quality factor (Q-factor) [4–6].

The machining process of the hemispherical resonator includes blank forming, ultra-precision grinding, magnetorheological polishing, chemical etching, and focused ion beam trimming [7–12]. Scratch defects are easily introduced during the grinding stage. Although magnetorheological polishing can effectively eliminate these scratches, it suffers from low processing efficiency. To balance the requirements for high performance and high processing efficiency, the magnetorheological polishing step can be omitted, and chemical etching can be performed directly after ultra-precision grinding. While chemical etching effectively removes subsurface damage, it can also enlarge and passivate existing scratches [13]. Scratches of varying sizes and positions may degrade the local mass-stiffness-damping symmetry of the hemispherical resonator, leading to frequency splitting and a reduction in the Q-factor.

SinoTechIntel Interactive Document Reader
Page 1–5 of Preview
100%
Download Full PDF

Loading authentic research manuscript (Pages 1–5)...

Sponsored Research Partner
Cite This Research Paper
Jingyang Guo, Henan Liu, Mingjun Chen, Jian Cheng (2025). Simulation Analysis of How Scratches Influence Frequency Splitting and Energy Dissipation of Hemispherical Resonator. Chinese Journal of Mechanical Engineering. https://doi.org/10.1186/s10033-025-01350-3
SinoTechIntel Academic & Legal Disclaimer

Research & Educational Purpose Only:The translations, structured abstracts, analytical annotations, and data reports provided by SinoTechIntel are intended exclusively for academic research, internal corporate R&D, and educational benchmarking. They do not constitute formal engineering, chemical safety, legal, or professional advice.

Copyright & Intellectual Property Notice: Original copyright of the underlying source articles and experimental data remains with the respective authors, institutions, and original publishing journals. SinoTechIntel claims intellectual property only over its proprietary translations, analytical syntheses, and AEO structured enhancements in accordance with international fair use and academic citation principles.

Frequently Asked Questions

What is the main focus of this study?

The study investigates how scratch defects on a hemispherical resonator affect frequency splitting and energy dissipation (thermoelastic damping and anchor loss), using finite element simulations and focused ion beam trimming experiments.

How do scratches influence frequency splitting?

Scratches cause frequency splitting by altering the mass-stiffness-damping symmetry. The effect depends on the scratch's latitude, length, and volume of material removed. Scratches above 55° latitude cause splitting solely due to stiffness changes, and splitting increases linearly with removed volume.

What is the impact of scratches on energy dissipation?

Scratches have little effect on thermoelastic damping, but they significantly affect anchor loss. The first three harmonics of the unbalanced mass caused by scratches at the rim are the primary contributors to anchor loss.

What are the practical implications of this research?

The findings provide guidance for evaluating the impact of scratches on hemispherical resonator performance and for developing appropriate trimming processes to minimize frequency splitting and energy dissipation, thereby improving gyroscope accuracy and reliability.

How were the simulation results validated?

Focused ion beam trimming experiments were conducted at different locations on the hemispherical resonator, and the trends observed in the experimental results were consistent with the simulation results, validating the models.

Recommended Scientific Literature & Research Partners

Related Technical Papers & Translations

Research Paper
Direct Repair of the Crystal Structure and Coating Surface of Spent LiFePO4 Materials Enables Superfast Li-Ion Migration

Direct Repair of the Crystal Structure and Coating Surface of Spent LiFePO4 Materials Enables Superfast Li-Ion Migration

The rapid accumulation of spent LiFePO4 (LFP) cathodes from retired lithium-ion batteries necessitates the development of effective and environmental-friendly recycling strategies. In this context, direct regeneration has emerged as a promising approach for reclaiming LFP cathode materials, offering a streamlined pathway to restore their electrochemical functionality. We report an integrated regeneration protocol that simultaneously repairs the degraded crystal structure and reconstructs the damaged carbon coating in spent LFP. The regenerated cathode material had superfast lithium-ion diffusion kinetics and a stable cathode–electrolyte interface, giving a remarkable rate capability with specific capacities of 122 mAh g−1 at 5C and 106 mAh g−1 at 10C (1C = 170 mA g−1). It also maintained capacities of 110.7 mAh g−1 (5C) and 84.1 mAh g−1 (10C) after 400 cycles. It could be used in harsh environments and could be stably cycled at subzero temperatures (−10 and −20 °C) and in solid-state electrolyte batteries. Life cycle assessment combined with economic evaluation using the EverBatt model reveals that this direct regeneration approach has high economic and environmental benefits.

Read Abstract & PDF
Research Paper
Oxide Semiconductor for Advanced Memory Architectures: Atomic Layer Deposition, Key Requirement and Challenges

Oxide Semiconductor for Advanced Memory Architectures: Atomic Layer Deposition, Key Requirement and Challenges

Oxide semiconductors (OSs), introduced by the Hosono group in the early 2000s, have evolved from display backplane materials to promising candidates for advanced memory and logic devices. The exceptionally low leakage current of OSs and compatibility with three-dimensional (3D) architectures have recently sparked renewed interest in their use in semiconductor applications. This review begins by exploring the unique material properties of OSs, which fundamentally originate from their distinct electronic band structure. Subsequently, we focus on atomic layer deposition (ALD), a core technique for growing excellent OS films, covering both basic and advanced processes compatible with 3D scaling. The basic surface reaction mechanisms—adsorption and reaction—and their roles in film growth are introduced. Furthermore, material design strategies, such as cation selection, crystallinity control, anion doping, and heterostructure engineering, are discussed. We also highlight challenges in memory applications, including contact resistance, hydrogen instability, and lack of p-type materials, and discuss the feasibility of ALD-grown OSs as potential solutions. Lastly, we provide an outlook on the role of ALD-grown OSs in memory technologies. This review bridges material fundamentals and device-level requirements, offering a comprehensive perspective on the potential of ALD-driven OSs for next-generation semiconductor memory devices.

Read Abstract & PDF
Research Paper
Laser powder bed fusion of biodegradable Zn-4Cu alloy: Processing, microstructure and properties

Laser powder bed fusion of biodegradable Zn-4Cu alloy: Processing, microstructure and properties

Zn's natural degradability and biocompatibility make it a promising candidate for implants, however, its mechanical properties remain insufficient for bone applications. In this study, the performance of Zn was enhanced by developing Zn-Cu alloys via laser powder bed fusion (LPBF). Optimal LPBF parameters for forming stable tracks were achieved by adjusting laser power and scanning speed. Under optimized conditions of 100 W and 100 mm/s, high-density (99.58%) Zn-Cu alloys with improved hardness (68.2HV) and yield strength (160 MPa) were achieved. These improvements are attributed to solid solution strengthening, segregation strengthening, and grain refinement. The Zn-Cu alloys also demonstrated favorable degradation behavior, with a rate of 0.16 mm/year. This degradation is primarily driven by micro-galvanic corrosion between the CuZn5 phase and Zn matrix, along with refined grains and increased grain boundary density. This work demonstrates a viable strategy for fabricating Zn-based implants with enhanced structural integrity and mechanical performance via LPBF.

Read Abstract & PDF