Key Takeaways & Executive Findings
- •• A Ga-diamond composite putty (LMP) is developed via ultrasonic fragmentation, overcoming LM surface tension and wettability issues for easy coating on polymer substrates. • The LMP-TPU composite achieves an exceptional deformation capacity of 1100% and maintains ultrahigh conductivity (20000 S/m) even at 600% strain. • The material delivers an electromagnetic interference shielding effectiveness of up to 52 dB, making it highly effective for EMI shielding applications. • The putty exhibits temperature-tunable soft/hard properties, enabling shape molding and versatile use in flexible electronics, infrared stealth, and reconfigurable circuits.
Abstract
The development of stretchable conductors with high deformation, conductivity, and thermal conductivity using liquid metal (LM) has sparked widespread interest in the fields of flexible electronics, electromagnetic interference (EMI), and multifunctional materials. However, fabricating desirable shielding materials by directly coating LMs on soft polymer substrates remains a challenge because of the huge surface tension and weak wettability of LMs. In this study, Ga-based composite paste is prepared from a mixture of Ga and diamond nonmetallic particles through ultrasonic fragmentation. At various temperatures, the resulting LM composite putty (LMP) exhibits soft and hard properties and can thus be molded into specific shapes according to application needs. In addition, the composite can be easily coated onto polymer substrates, such as thermoplastic polyurethane (TPU) elastomer. The fabricated LMP–TPU exhibits an impressive shape deformation capacity of 1100%, demonstrating exceptional tensile properties and achieving electromagnetic interference–shielding effectiveness of up to 52 dB. Furthermore, it retains an ultrahigh conductivity of 20000 S/m, even under a strain of 600%. This feature further makes it a highly competitive multifunctional material.
1. Introduction
The rapid development of electronic products inevitably causes electromagnetic pollution and electromagnetic interference (EMI), affecting not only communication and endangering human health but also the normal operations of military equipment, thus posing a threat to the security of a country and the people [1–4]. Therefore, promoting the development of materials with effective EMI-shielding capabilities is critical [5]. Liquid metals (LMs) with high electrical conductivity, thermal conductivity, excellent biocompatibility, and extraordinary fluidity have emerged as promising functional materials [6]. Owing to the increasing demand for portable devices, flexible and lightweight shielding materials are required. Liquid Ga-based materials for preparing soft and stretchable electronic products are promising materials. However, the surface tension of LMs can increase the difficulty of processing, especially for patterning or reshaping [7]. To overcome these problems, a method of adding fillers was used in preparing liquid Ga-based composite materials and has been proven to be effective [8].
Ga remains liquid at room temperature and has various properties, including high electrical and moderate thermal conductivity and low toxicity [9]. Ga-based materials are considered promising for the fabrication of soft and stretchable electronics and hold tremendous potential for the synthesis of intelligent functional materials [10]. The involvement of Ga-based materials is indispensable in the development of next-generation wearable devices, soft robotics, and biocompatible devices. Liquid Ga is combined with different types of materials for the preparation of functional composite materials, demonstrating good biocompatibility, excellent conductivity, and outstanding deformation ability of LMs. Researchers have found that mixing Ga with other functional materials, such as Cu [11], W [8], diamond [12], and modified graphite, can result in high thermal conductivity and thermal conductivity [13–15].
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Lulu Liu, Mengmeng Lin, Linan Wang, Zhen Liu, Li Guan, Quanlin Li, Hongxia Lu, Zhongyi Wang, Biao Zhao, Rui Zhang (2025). Adaptable liquid metal putty for high electromagnetic shielding. Int. Journal of Minerals, Metallurgy and Materials (矿物冶金与材料学报). https://doi.org/10.1007/s12613-024-3050-1
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Frequently Asked Questions
What is the main challenge in using liquid metals for EMI shielding?
The main challenge is the high surface tension and weak wettability of liquid metals, which makes it difficult to directly coat them onto soft polymer substrates for shielding applications.
How does the liquid metal putty (LMP) overcome the processing issues?
The LMP is prepared by ultrasonic fragmentation of a mixture of gallium and diamond particles, resulting in a composite paste that can be easily molded and coated onto substrates like thermoplastic polyurethane (TPU).
What are the key performance metrics of the LMP-TPU composite?
The LMP-TPU composite exhibits a shape deformation capacity of 1100%, an EMI shielding effectiveness of up to 52 dB, and retains an ultrahigh conductivity of 20000 S/m even under 600% strain.
What applications can benefit from this liquid metal putty?
The putty's unique properties make it suitable for flexible electronics, electromagnetic interference shielding, infrared stealth, reconfigurable circuits, and other multifunctional applications.
Is the liquid metal putty temperature-responsive?
Yes, the putty exhibits soft and hard properties at various temperatures, allowing it to be molded into specific shapes according to application needs.
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