Adaptable liquid metal putty for high electromagnetic shielding

• A Ga-diamond composite putty (LMP) is developed via ultrasonic fragmentation, overcoming LM surface tension and wettability issues for easy coating on polymer substrates. • The LMP-TPU composite achieves an exceptional deformation capacity of 1100% and maintains ultrahigh conductivity (20000 S/m) even at 600% strain. • The material delivers an electromagnetic interference shielding effectiveness of up to 52 dB, making it highly effective for EMI shielding applications. • The putty exhibits temperature-tunable soft/hard properties, enabling shape molding and versatile use in flexible electronics, infrared stealth, and reconfigurable circuits.