Two-Dimensional Materials, the Ultimate Solution for Future Electronics and Very-Large-Scale Integrated Circuits

• 2D materials offer atomic thickness and maintain carrier mobility at sub-5 nm, overcoming the limitations of bulk Si in advanced nodes. • They enable superior gate electrostatic control, mitigating short channel effects and reducing power consumption in ICs. • Recent breakthroughs include contact engineering, dielectric integration, and full-functioned processors, demonstrating potential for large-scale integration. • Challenges remain in producing large-scale, high-quality 2D materials and developing mature fabrication techniques for commercial VLSI.