• The gate oxide region is the most sensitive position in planar SiC MOSFETs under heavy-ion irradiation.
• Trench and double-trench structures do not exhibit localized sensitive regions, indicating different failure mechanisms.
• Single-event susceptibility shows strong depth dependence, with greater vulnerability at deeper ion penetration depths.
• TCAD simulations provide comparative insights into the structural influence on single-event effects, guiding radiation-hardened design.
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