• Vertical power delivery (VPD) with multi-chip multi-phase DC−DC converters enables core rail currents exceeding 2 kA and reduces PDN losses, saving >100 W per processor.
• A two-stage 48 V to sub-1 V conversion architecture, combining an LLC DCX and an ultra-thin multiphase buck, achieves high power density and fast transient response.
• The choice of interconnection topology (ring, chain, or net) and control scheme (independent or master-slave) significantly impacts scalability, fault tolerance, and current sharing in multi-chip converters.
• Advanced packaging and 48 V architectures are key to meeting AI power demands while reducing carbon footprint in large-scale datacenters.