Key Takeaways & Executive Findings
- •• Laser-induced percolation interlocking technology enables the development of robust, open-structured nanowire (NW) electrodes through the photothermal effect at the interface between NW and substrate. • The optimized NW electrode with enhanced mechanical and electrical properties can be used as reusable wearable electronics. • Stable functionalization of the percolation-interlocked NW electrode with various conducting polymers can be achieved, broadening the applicability as soft electronics. • The method is broadly applicable across different metallic nanowires and thermoplastic substrates, significantly enhancing its universality in diverse applications.
Abstract
Metallic nanowires have served as novel materials for soft electronics due to their outstanding mechanical compliance and electrical properties. However, weak adhesion and low mechanical robustness of nanowire networks to substrates significantly undermine their reliability, necessitating the use of an insulating protective layer, which greatly limits their utility. Herein, we present a versatile and generalized laser-based process that simultaneously achieves strong adhesion and mechanical robustness of nanowire networks on diverse substrates without the need for a protective layer. In this method, the laser-induced photothermal energy at the interface between the nanowire network and the substrate facilitates the interpenetration of the nanowire network and the polymer matrix, resulting in mechanical interlocking through percolation. This mechanism is broadly applicable across different metallic nanowires and thermoplastic substrates, significantly enhancing its universality in diverse applications. Thereby, we demonstrated the mechanical robustness of nanowires in reusable wearable physiological sensors on the skin without compromising the performance of the sensor. Furthermore, enhanced robustness and electrical conductivity by the laser-induced interlocking enables a stable functionalization of conducting polymers in a wet environment, broadening its application into various electrochemical devices.
1. Introduction
Metallic nanowires (NWs) are recognized as exceptional electrical conductors for soft electronics due to their high electrical conductivity and stretchability [1–3]. However, the NW networks inevitably require a supportive substrate, since they cannot remain freestanding [4]. In this context, NW-based conductive fiber composites have achieved freestanding structures with high stretchability but remain vulnerable to friction-induced shear stress [5–7]. For sustainable functionality of the NW network, it is crucial to ensure the stability and integrity of the assembled structure comprising the NW electrode and the substrate under continuous external stimuli [8].
Because of the mechanical fragility of the NW network on the substrate, it has been encapsulated with protective layers to preserve its structure for its stable operation under external stimuli [9–11]. However, the presence of a protective layer prevents the NW network from directly interacting with surrounding environments, significantly restricting its potential for advanced applications, such as neutral probes and physiological sensors that require direct contact with biological systems [12–15]. In this regard, the NW network should be utilized as an open structure with high robustness to enhance its interaction capabilities.
Furthermore, an exposed structure of NW networks can further maximize the potential of NW networks, enabling the direct introduction of conducting polymers (CPs) on NW surfaces [16–18], which impart new functionalities with electrochemical interactions with surrounding environments [19, 20]. The high surface area of CP layers provided by the NW network enhances electrochemical interactions [21], making them suitable for various applications, including energy-harvesting devices [22], energy storage devices [23, 24], and smart windows [25, 26]. However, particularly in NW-based electrodes, the general solution-based electropolymerization (EP) process for depositing CPs directly onto the electrode leads to the dispersion of NWs into the solution, ultimately causing their failure due to weak adhesion with the substrate. Therefore, a robust open structure is necessary to ensure the stability and functionality of NW networks for electrochemical applications.
In this respect, laser-based thermal interactions such as sintering [27], reduction [28], and pyrolysis [29] have played a crucial role in fabrication of nanomaterial-based electrodes for soft electronics. Moreover, selective laser-based interactions have facilitated the rapid patterning of functional electrodes and the precise tailoring of th
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Yeongju Jung, Kyung Rok Pyun, Sejong Yu, Jiyong Ahn, Jinsol Kim, Jung Jae Park, Min Jae Lee, Byunghong Lee, Daeyeon Won, Junhyuk Bang, Seung Hwan Ko (2025). Laser-Induced Nanowire Percolation Interlocking for Ultrarobust Soft Electronics. Nano-Micro Letters. https://doi.org/10.1007/s40820-024-01627-7
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Frequently Asked Questions
What is the main innovation of this paper?
The paper presents a laser-induced nanowire percolation interlocking technique that simultaneously enhances the adhesion and mechanical robustness of metallic nanowire networks on diverse substrates without needing a protective layer, enabling open-structure electrodes for soft electronics.
How does the laser-induced interlocking work?
The laser-induced photothermal effect at the interface between the nanowire network and the polymer substrate causes interpenetration of the nanowires into the polymer matrix, creating mechanical interlocking through percolation, which strengthens the electrode-substrate interface.
What are the potential applications of this technology?
The robust nanowire electrodes can be used in reusable wearable physiological sensors, and the stable functionalization with conducting polymers enables applications in electrochemical devices such as energy storage, smart windows, and biosensors.
Is the method applicable to different materials?
Yes, the mechanism is broadly applicable across different metallic nanowires and thermoplastic substrates, enhancing its universality for various soft electronic applications.
What are the key advantages over existing methods?
The method eliminates the need for insulating protective layers, maintains an open structure for direct environmental interaction, and improves mechanical robustness and electrical conductivity, which are critical for reliable and high-performance soft electronics.
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