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Official PDF TranslationNano-Micro Letters

Enhanced Conductivity of Multilayer Copper–Carbon Nanofilms via Plasma Immersion Deposition

Authors: Haotian Weng; Xiwu Zhang; Xuan Liu; Yunhui Tang; Hewei Yuan; Yang Xu; Kun Li; Xiaolu Huang

DOI: 10.1007/s40820-024-01628-6Status: Verified Translated Edition
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Key Findings in This Report

• Multilayer copper–carbon nanofilms fabricated via plasma immersion deposition achieve up to 30.20% higher conductivity than pure copper. • Effective medium theory, first-principles calculations, and density of states analysis reveal the critical roles of copper atom adsorption sites and electron migration pathways in enhancing conductivity. • High-density electrons from copper migrate into the nanocarbon film under an applied electric field, forming efficient electron transport channels. • Large-scale electrode coating equipment was developed, enabling industrial production of copper–carbon nanocomposite films for high-conductivity applications.