Key Takeaways & Executive Findings
- •• Femtosecond laser ablation of SiC primarily involves melting and vaporization, with vaporization as the dominant material removal mechanism. • Micro-groove depth and width increase with higher pulse energy, pulse overlap rate, and number of passes. • Bottom roughness correlates positively with pulse energy, negatively with pulse overlap rate, and is minimally affected by number of passes. • The study provides theoretical insights for optimizing high-quality and high-efficiency femtosecond laser processing of SiC micro-grooves.
Abstract
Silicon carbide (SiC) is widely used in fields such as new energy, military radar, and aerospace due to its outstanding physical and chemical properties. The surface micro-grooves of SiC can enhance the performance of micro-electro-mechanical systems, micro-sensors, and field-effect transistors. However, SiC, being a brittle and hard material, poses challenges for traditional machining methods like micro-groove machining and chemical etching, including sub-surface damage, short tool life, and low processing efficiency. This paper investigates the processing characteristics of femtosecond laser machining of SiC micro-grooves and compares them with those of single-crystal Si. The results indicate that femtosecond laser ablation of SiC primarily leads to melting and vaporization, forming modification, melted, and ablation areas in the affected area. Femtosecond laser processing of SiC micro-grooves involves three processes: heat absorption and melting, vaporization, and chipping, with vaporization as the primary material removal mechanism. The depth and width of SiC micro-grooves are positively correlated with pulse energy (Ep), pulse overlap rate (PO), and number of passes (Npass). The bottom roughness of the micro-grooves is positively correlated with Ep, negatively correlated with PO, and less affected by changes in the Npass. These findings further elucidate the material removal and micro-groove formation mechanisms of SiC under femtosecond laser irradiation, providing theoretical insights for high-quality and high-efficiency processing of SiC micro-grooves.
1. Introduction
SiC, a core material for third-generation semiconductors, possesses unique physicochemical properties, including high-temperature resistance, high thermal conductivity, oxidation resistance, and corrosion resistance. It is widely used in new energy, military radar, and aerospace [1]. Micro-groove processing of SiC is primarily used in microelectromechanical systems (MEMS), microsensors, and field-effect transistors (FETs) [2]. For example, micro-groove structures can enable high-density interconnections on chips, increasing wafer density and facilitating the miniaturization of MEMS and microsensors. Moreover, compared to planar FETs, micro-groove FETs exhibit lower conduction losses and better switching performance [3], which significantly enhances the operational performance of electronic systems under harsh conditions.
Compared to single-crystal Si, SiC has a wider bandgap, higher hardness, and superior chemical stability, which makes it more challenging to micromachine. Conventional machining techniques often result in significant tool wear, surface cracks, and workpiece breakage [4]. Conventional chemical etching suffers from inefficiencies and requires masks [5]. Compared to traditional methods, laser processing offers advantages such as contactless operation, high precision, and high efficiency, making it suitable for microfabricating SiC [6]. However, challenges remain in the laser processing of SiC micro-grooves, including a limited depth-to-width ratio, groove edge recasting, and chipping [7]. As a result, high-efficiency and high-quality laser direct machining of SiC micro-grooves has garnered significant attention from researchers.
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Lijuan Zheng, Xiangqian Xu, Wenwen Tao, Yong Sun, Yongfeng Zhao, Chuanhong Hu, Xiongbing Tao, Xin Wei, Chengyong Wang (2025). Characterization of Micro-grooves Processed Using a Green Femtosecond Laser in Silicon Carbide. Chinese Journal of Mechanical Engineering. https://doi.org/10.1186/s10033-025-01306-7
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Frequently Asked Questions
What are the main challenges in machining SiC micro-grooves?
SiC is a brittle and hard material, making traditional machining methods like micro-groove machining and chemical etching prone to sub-surface damage, short tool life, and low processing efficiency.
What is the primary material removal mechanism in femtosecond laser processing of SiC?
The primary material removal mechanism is vaporization, although the process also involves heat absorption, melting, and chipping.
How do pulse energy, pulse overlap rate, and number of passes affect micro-groove dimensions?
The depth and width of SiC micro-grooves are positively correlated with pulse energy, pulse overlap rate, and number of passes.
What is the effect of processing parameters on bottom roughness of micro-grooves?
Bottom roughness is positively correlated with pulse energy, negatively correlated with pulse overlap rate, and less affected by changes in the number of passes.
What are the potential applications of SiC micro-grooves?
SiC micro-grooves are used in microelectromechanical systems (MEMS), microsensors, and field-effect transistors (FETs) to enhance performance and enable miniaturization.
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