Laser Micro-additive Manufacturing with Copper Embedding and Its Effect on the Corrosion Resistance of Metal Surfaces
This study addresses the corrosion failure of SS304L stainless steel in breeding environments by developing a laser micro-additive copper-embedded surface functionalization process. A 355 nm nanosecond laser with 60 W average power, 40 kHz repetition rate, and 16 ns pulse width was used to embed a 0.12 µm Cu foil onto SS304L substrates under three coating strategies: single-layer, double-layer, and double-pass, each at scanning speeds of 400, 800, and 1200 mm/s. Surface characterization via 3D profilometry, SEM, EDS, and XPS revealed regular grooves and micro-concave structures with height differences increasing from 0.1 µm (untreated) to 1.6–3.8 µm, with the double-pass sample achieving the maximum 3.8 µm. Cu particles were successfully embedded, forming CuO and Cu2O oxide layers. Electrochemical tests in 3.5 wt.% NaCl solution showed that the optimal sample (double-layer coating at 800 mm/s, designated b2) exhibited the highest corrosion potential (increased by ~0.04 V), a one-order-of-magnitude reduction in corrosion current, and a maximum charge transfer resistance (Rct) of 6954 Ω·cm². These results demonstrate that laser micro-additive embedding of copper synergistically enhances the corrosion resistance of stainless steel through surface texturing, copper particle incorporation, and oxide film formation.