• Dry electrical discharge assisted grinding (DEDAG) significantly improves surface quality of SiCp/Al composites, achieving a 19.2% average reduction in surface roughness compared to conventional grinding.
• DEDAG reduces axial, tangential, and normal grinding forces by approximately 10.5%, 37.8%, and 23.0%, respectively, indicating lower mechanical loads and reduced tool wear.
• The proposed method produces smaller chip sizes and lower grinding temperatures, contributing to less thermal damage and improved machinability of the composite.
• Optimized process parameters (N=2500 r/min, vf=30 mm/min, a=10 µm, E=15 V, f=5000 Hz, dc=80%) yield a surface roughness of 0.161 μm, demonstrating the potential for high-precision machining.