Optimizing the overall performance of Cu–Ni–Si alloy via controlling nanometer-lamellar discontinuous precipitation structure

• A novel deformation-aging and cold rolling process creates nanometer-lamellar discontinuous precipitates aligned in the same direction, enhancing strength while maintaining high electrical conductivity. • The alloy achieves a tensile strength of 882.67 MPa, yield strength of 811.33 MPa, and electrical conductivity of 45.32% IACS, outperforming many conventional Cu–Ni–Si alloys. • The strengthening is attributed to nanometer-lamellar DPs and dislocation strengthening, with dislocation accumulation at interfaces reducing matrix dislocation density and limiting conductivity loss. • This work provides a new pathway for microstructure design of Cu–Ni–Si alloys, potentially expanding their application in high-precision electronics.