Key Takeaways & Executive Findings
- •• 3D graphene-CNT-SiC hybrid materials achieve a thermal conductivity of 123 W·m–1·K–1 and electromagnetic shielding effectiveness of 29.3 dB at 2% SiC addition. • SiC whiskers form a framework for longitudinal thermal conduction, while CNTs create dendritic structures that enhance interfacial bonding and dielectric loss. • The aqueous-phase reduction method enables self-assembly of graphene oxide into a three-dimensional porous structure, facilitating the integration of SiC and CNTs. • The hybrid material demonstrates dual functionality, addressing both heat dissipation and electromagnetic interference shielding for electronic packaging applications.
Abstract
During the operation of electronic devices, a considerable amount of heat and electromagnetic radiation is emitted. Therefore, the investigation of materials with electromagnetic shielding and thermal management abilities has significant importance. Hybrid materials of three-dimensional graphene networks containing both carbon nanotubes (CNTs) and SiC whiskers (3D graphene-CNT-SiC) were synthesized. Using an aqueous-phase reduction method for the self-assembly of the graphene oxide, a three-dimensional porous graphene structure was fabricated. SiC whiskers, inserted between the graphene layers, formed a framework for longitudinal thermal conduction, while CNTs attached to the SiC surface, created a dendritic structure that increased the bonding between the SiC whiskers and graphene, improving dielectric loss and thermal conductivity. It was found that the thermal conductivity of the hybrid material reached 123 W·m–1·K–1, with a shielding effectiveness of 29.3 dB when the SiC addition was 2%. This result indicates that 3D graphene-CNT-SiC has excellent thermal conductivity and electromagnetic shielding performance.
1. Introduction
Artificial intelligence (AI), exemplified by ChatGPT, has ushered in a new era of technological revolution, relying on high-performance chips and large-scale integrated circuits as fundamental hardware. However, the escalating integration and power density of these components present formidable challenges for heat dissipation [1–5]. Moreover, their operation emits considerable electromagnetic radiation, which disrupts neighboring devices and poses health risks. Hence, materials for electronic packaging with superior thermal conductivity and electromagnetic interference (EMI) shielding properties are highly desirable [6]. To expedite the advancement of AI, the creation of dual-functional electronic packaging materials possessing both high thermal conductivity and EMI shielding capabilities holds practical significance.
Graphene, a two-dimensional (2D) material, boasts remarkable properties such as high electrical and thermal conductivity, large specific surface area, and high electron mobility. Moreover, its unique electron polarization and defect polarization relaxation impart exceptional electromagnetic shielding capabilities [7–10]. Silicon carbide (SiC) exhibits outstanding thermal conductivity (reaching up to 490 W·m–1·K–1 theoretically), notable strength and thermal stability, making it widely used in the field of thermal management [11–14]. Leveraging the distinct advantages of graphene and SiC in electromagnetic shielding and thermal conduction, researchers have conducted extensive studies on their composites.
Shi et al. [15] introduced an innovative method that integrates ice templating with mechanical vibration to develop filler networks composed of reduced graphene oxide (rGO) and silicon carbide whiskers (SiC), arranged both horizontally and vertically. This composite, containing 3.88% hybrid fillers, achieved a through-plane thermal conductivity of 5.24 W·m–1·K–1. The thermal conductivity anisotropy of the composite was measured at 1.35, which is attributed to the strategic orientation of the filler network in both vertical and horizontal planes. Furthermore, the composite exhibited a total electromagnetic interference (EMI) shielding effectiveness of 35.2 dB, coupled with low electromagnetic reflection, indicating excellent EMI shielding properties. Xie et al. [16] prepared surface-modified C/C composites using C/C composites as the matrix, 1D SiC as an intermediary layer, and vertically oriented ...
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FENG Fan, HAN Zhi-dong, WEI Bing, WANG Yang, WANG Fei-zhou, JIAO Yan-yan, WANG Zhen-ting (2025). Increasing both the electromagnetic shielding and thermal conductive properties of three-dimensional graphene-CNT-SiC hybrid materials. SinoTechIntel Verified Research. https://doi.org/10.1016/S1872-5805(NCM2024-39-06-09)
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Frequently Asked Questions
What is the thermal conductivity of the 3D graphene-CNT-SiC hybrid material?
The hybrid material achieves a thermal conductivity of 123 W·m–1·K–1 when the SiC addition is 2%.
What is the electromagnetic shielding effectiveness of the 3D graphene-CNT-SiC hybrid material?
The material exhibits a shielding effectiveness of 29.3 dB at 2% SiC addition.
How are the 3D graphene-CNT-SiC hybrid materials synthesized?
They are synthesized using an aqueous-phase reduction method for self-assembly of graphene oxide into a three-dimensional porous structure, with SiC whiskers inserted between graphene layers and CNTs attached to SiC surfaces.
What roles do SiC whiskers and CNTs play in the hybrid material?
SiC whiskers form a framework for longitudinal thermal conduction, while CNTs create a dendritic structure that increases bonding between SiC and graphene, improving dielectric loss and thermal conductivity.
Why are dual-functional materials with thermal conductivity and EMI shielding important?
Electronic devices emit heat and electromagnetic radiation during operation; materials with both high thermal conductivity and EMI shielding are needed for effective thermal management and to prevent electromagnetic interference, especially in AI and high-performance electronics.
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