• 3D carbon-based thermally conductive networks significantly enhance heat dissipation in high-power electronics by providing interconnected pathways for phonon transport.
• Graphene, carbon nanotubes, and carbon foam are key building blocks; their assembly into 3D structures overcomes the anisotropic thermal conductivity limitations of individual materials.
• The microscopic principles of thermal conductivity, including phonon scattering and mean free path, are critical for designing efficient 3D networks.
• Challenges remain in scalable fabrication and precise control of network architecture, but future prospects include multifunctional composites for thermal management applications.