• Silica abrasives dominate the CMP market (>90%) and operate via a chemical-mechanical synergistic mechanism essential for sub-7 nm IC manufacturing.
• Innovations in particle structure (mesoporous, hollow, raspberry) and surface modifications significantly improve dispersion, reduce defects, and enhance material removal rate.
• State-of-the-art silica slurries achieve surface roughness below 0.1 nm RMS, meeting stringent requirements for advanced nodes.
• Future development focuses on biodegradable and smart abrasives to align with green manufacturing and simplify post-CMP cleaning.