• Micro/nanoparticle reinforcement significantly enhances the wettability, mechanical properties, creep resistance, and corrosion resistance of Sn-based solders.
• The addition of nanoparticles suppresses the growth of intermetallic compounds (IMCs) during soldering, improving joint strength and reliability.
• The review systematically summarizes the types, contents, sizes, and doping methods of reinforcing particles and their effects on solder properties over the past decade (2014–2024).
• The paper identifies current challenges and future directions for developing high-performance Pb-free composite solders for electronic packaging.