Key Takeaways & Executive Findings
- •• Carbon materials, including carbon fibers, carbon nanotubes, graphene, and amorphous carbon, are promising for dual-function high thermal conductivity and microwave absorption applications. • Structural design strategies such as core-shell structures, three-dimensional networks, and heteroatom doping significantly enhance both thermal conductivity and electromagnetic wave absorption performance. • Combining carbon materials with other high thermal conductivity components can achieve integrated heat conduction and EWA, addressing impedance mismatch and single loss mechanisms. • Future design of carbon-based high thermal conduction microwave absorbing materials should focus on overcoming dispersion challenges and optimizing structure-property relationships.
Abstract
The ever-increasing integration of electronic devices has inevitably caused electromagnetic interference and heat accumulation problems, and dual-function materials with both a high thermal conductivity and high electromagnetic wave absorption (EWA) are regarded as an effective strategy for solving these problems. Carbon materials are widely used as thermal and EWA fillers due to their excellent conductivity and outstanding thermal conduction properties, and have become a research hotspot in the field of high thermal conductivity, microwave absorbing materials in recent years. The status of current research progress on carbon-based high thermal-conduction microwave absorption materials, including carbon fibers, carbon nanotubes, graphene and amorphous carbon, is reviewed, and the influence of the structure of the materials on their absorption and thermal conductivity properties, such as core-shell structure, three-dimensional network structure, and heteroatom doping, is also elaborated. Feasible solutions for the current problems with these materials are proposed, with the aim of providing valuable guidance for the future design of carbon-based high thermal conduction microwave absorbing materials.
1. Introduction
The ever-increasing miniaturization, integration and network of electronic devices have inevitably brought about issues of electromagnetic interference and heat accumulation problems[1–3]. High thermal conductivity electromagnetic interference shielding or EWA materials are regarded as a strategy to solve the above problems[4–6]. However, the undesirable secondary electromagnetic radiation caused by electromagnetic interference shielding materials can affect the deployment of electronic devices. High thermal conductivity EWA materials can eliminate the undesirable secondary electromagnetic radiation, thus increasing the attention received in recent years[7].
Commercial high thermal conductivity EWA materials are usually prepared by mixing corresponding thermally conductive and EWA fillers with polymer matrix materials. Unfortunately, adding two different functional fillers simultaneously to polymer matrix material greatly reduces mechanical properties. Meanwhile, it is difficult for polymer-based composites to combine excellent thermal conductivity and EWA performance when the amount of fillers are kept within certain limits to ensure good processing and mechanical properties[8]. Therefore, the development of fillers with both high thermal conductivity and excellent EWA performance is highly desired.
Recently, carbon materials have received significant attention in the fields of high thermal conductivity EWA materials owing to their excellent conductivity, low density, outstanding thermal and mechanical properties[9–11]. However, the impedance mismatching and single loss mechanism of pure carbon materials are also two major obstacles hindering their EWA performance. Besides, carbon materials are prone to agglomeration and struggle to achieve good dispersion in polymer matrices, resulting in poor thermal conductivity and EWA performance. Hence, achieving an excellent dispersion of carbon materials in polymer is important for both practical applications and fundamental carbon science[12].
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LI Zheng-xuan, WU Xi, JIANG Bo, YANG Wang, DONG Jun-yan, DING Zhong-zhen, ZHANG Chen, DU Shao-xiong, LI Si-yuan, FENG Ruo-yao, LI Yong-feng (2025). A review of high thermal conductivity carbon-based materials for microwave absorption materials. SinoTechIntel Verified Research. https://doi.org/10.1016/S1872-5805(NCM2025-40-01-04)
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Frequently Asked Questions
What are the main challenges in developing high thermal conductivity microwave absorbing materials?
The main challenges include achieving both high thermal conductivity and excellent electromagnetic wave absorption simultaneously, avoiding impedance mismatch, and ensuring good dispersion of fillers in polymer matrices without compromising mechanical properties.
Which carbon materials are reviewed in this paper?
The paper reviews carbon fibers, carbon nanotubes, graphene, and amorphous carbon as high thermal conductivity microwave absorption materials.
How do structural designs like core-shell or 3D networks improve performance?
Structural designs such as core-shell structures, three-dimensional networks, and heteroatom doping enhance both thermal conductivity and electromagnetic wave absorption by improving impedance matching, providing multiple loss mechanisms, and facilitating heat conduction pathways.
What is the significance of combining carbon materials with other components?
Combining carbon materials with other high thermal conductivity components can achieve integrated heat conduction and electromagnetic wave absorption, addressing the limitations of pure carbon materials and improving overall performance.
What future directions are suggested for carbon-based high thermal conduction microwave absorbing materials?
Future directions include optimizing dispersion in polymer matrices, designing novel structures to enhance both thermal and absorption properties, and exploring synergistic effects with other materials to overcome current limitations.
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