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A 2D/3D vision chip based on organic substrate 3D package

Authors: Siyuan Wei; Quanmin Chen; Jingyi Yu; Xuanzhe Xu; Yuxiao Wen; Runjiang Dou; Shuangming Yu; Guike Li; Kaiming Nie; Jie Cheng; Jiangtao Xu; Liyuan Liu; Nanjian Wu

DOI: 10.1088/1674-4926/25010030Status: Verified Translated Edition
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Key Findings in This Report

• The vision chip integrates a 2D/3D image sensor with a programmable visual processor using organic substrate 3D packaging, enabling compact end-to-end visual SoC. • A novel on-chip processing flow with die-to-die image transmission and low-latency fixed-point processing supports real-time CNNs and conventional algorithms. • The end-to-end 2D/3D vision system achieves real-time applications: face detection with 10.2 ms delay and depth map reconstruction with 4.1 ms delay. • The system maintains a frame rate exceeding 30 fps for image acquisition, processing, and display, demonstrating practical viability.